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Intel at its architecture day revealed one of the more exquisite in-house designs for the company in recent years: a hybrid x86 chip that seems to imbibe from ARM's own big.Little design mantra. The new Hybrid x86 CPU that was announced takes this design choice in pairing a single, high-performance Sunny Cove core with four smaller Atom cores. This chip is built using Intel's Foveros manufacturing technology, which means a 22FFL IO chip serves as an active interposer, connected via TSVs to a 10nm die that contains both types of cores. The tiny chips measures just 12 x 12 x 1 mm (144 mm²), and looks to reduce footprint even further by including a POP (package on package) memory design. The new Intel design is aimed at low-power environments, with the chip having been designed to work on a 2 mW standby power ratio, with less than a 7 W of power - for a big.Little five-core design and a 64 EU design with Gen11 graphics core.
![Hybrid Hybrid](https://i.pinimg.com/474x/1c/48/9c/1c489cff1c0141b83b3692135caeca66--x-windows-.jpg)
Intel's Jim Keller said that the company is testing the intricacies and advantages of this design internally, so more products based on this manufacturing and packaging mantra could pop up sometime in the future.